FPC
Drilling
Drill Hole Size : Ø0.1~6.2mm
Processed Material: Flexible Copper Clad Laminate (FCCL)、Cover film、EMI Film、PET、ITO Film
Maximum Drill Size: 400*450mm
Maximum Capacity: 60,000 cut/hr
Electroplating
Processed Material: Flexible Copper Clad Laminate (FCCL)、Triplex
Board Thickness: 0.4~1.6mm
Maximum Board Size:250*420mm
Maximum Capacity:67.5Panel/hr(by250*420mm)
Exposure
Processed Material: Flexible Copper Clad Laminate (FCCL)、Triplex
Exposure Layer | Exposure Alignment accuracy | Maximum Size |
Maximum Capacity | Minimum. Trace Width (L/S) | |
MANUAL INNER/OUTER LAYER UV LED EXPOSURE SYSTEM | Double-sided | 100um | 350*450mm | 144Panel/hr | 75um/75um |
AUTO INNER/OUTER LAYER COLLIMATED UV EXPOSURE SYSTEM | Double-sided | 60um | 350*450mm | 102Panel/hr | 75um/75um |
AUTO INNER LAYER UV LED EXPOSURE SYSTEM | Single side | 60um | 420*250mm | 90Panel/hr | 75um/75um |
Etching
Processed Material: Flexible Copper Clad Laminate (FCCL)、Triplex
Maximum Size:500*500mm
Maximum Capacity:250Panel/hr
Developing: Remove the un-polymerized dry film on the copper foil that has not been exposed to ultraviolet rays.
Etching: Remove the copper without dry film on the copper foil.
Stripping: Remove the dry film on the circuit that has polymerized due to ultraviolet irradiation
Lamination
Processed Material: Cover layer、EMI Film、PI Stiffener、FR4 Stiffener、SUS Stiffener
Maximum Size:
Vacuum Lamination Press Series: 320*500mm
80TON Vacuum Laminator: 250*420mm
100TON Vacuum Laminator: 440*500mm
Routing /Milling
Processed Material: Bakelite board、acrylic、Stononlead、Light Guide flim、Overlay、LENS、spacer、FR4、Shield、light stopper、diffuser
Maximum Size:450*420mm